Development of holistic measurement concepts for highly resolved measurement of micro structures based on scanning and imaging optical techniques
Due to a continuous down-scaling of technical components, the demand for measurement technology used for quality control increases. Optical 3D topography measurement instruments enable a fast and contactless measurement of 2D height profiles.
Caused by the wave characteristics of light, systematic deviations between optically measured and real surface topographies occur, which reduce the reliability of optical measurement technology significantly. These deviations depend on various measurement parameters, the state of the surface as well as the used measurement method.
In this project, we develop numerical simulation models, which enable to predict these deviations reliably for different optical profilers (see Figs. 1-3). The models are used to investigate physical dependencies of the systematics deviations, recognize the discrepancies and eliminate them directly in the measurement chain and find the most accurate measurement instrument with regard to certain applications.